Rocket-PCB has revolutionized the PCB industry with its cutting-edge technology, offering high precision any layer HDI multilayer PCB fabrication. Among its impressive array of products is the 10 layer ELIC printed circuit board, crafted with precision and expertise to meet the diverse needs of its users. This article aims to delve into the technical aspects of this remarkable PCB, exploring its materials, design, and manufacturing techniques.


Material and Board Thickness

The 10 layer ELIC PCB from Rocket-PCB is constructed using FR4, a popular substrate material known for its excellent mechanical and thermal properties. FR4 is widely favored in the PCB industry due to its high durability and cost-effectiveness. The board thickness is set at 1.6mm, striking the right balance between stability and space-saving design, making it suitable for various applications, including consumer electronics, industrial equipment, and automotive systems.

Surface Treatment: Immersion Gold

To ensure reliable performance and enhance the PCB’s solderability, Rocket-PCB employs an immersion gold surface treatment. This process involves immersing the PCB in a solution containing gold particles, which form a thin, protective gold layer on the exposed copper traces and pads. The immersion gold surface finish provides excellent electrical conductivity, while also preventing oxidation and ensuring a smooth surface for soldering components.

Stack Up: N+N Configuration

Rocket-PCB utilizes a stack up configuration of N+N for their 10 layer ELIC PCB. The N+N stack up refers to the use of multiple cores and prepreg layers in a symmetrical arrangement to facilitate impedance control and signal integrity. This design allows for the creation of highly complex circuits with improved electrical performance and minimal crosstalk between adjacent signal layers.

Track/Width and Laser Vias

The 10 layer ELIC PCB boasts impressive track/width dimensions of 3/3mil, demonstrating Rocket-PCB’s commitment to providing high precision solutions. The narrow track and spacing enable efficient routing of signals and ensure that the PCB can handle high-frequency signals without signal degradation.

Moreover, the PCB incorporates advanced technology, including laser vias. These vias are created using laser ablation techniques, allowing for smaller via diameters and higher density interconnects. Laser vias are particularly advantageous in high-density designs, where space is limited, and precise signal paths are essential for optimal circuit performance.

Blind and Buried Vias

Rocket-PCB’s 10 layer ELIC PCB fabrication supports blind and buried vias. Blind vias connect an outer layer to one or more inner layers, while buried vias connect two or more inner layers without extending to the outer surfaces. By utilizing blind and buried vias, the PCB achieves higher circuit density, reducing the number of layers required and making it a cost-effective and space-saving solution.

Rocket-PCB’s 10 layer ELIC printed circuit board represents a pinnacle of high precision any layer HDI multilayer PCB fabrication. With its FR4 material, immersion gold surface treatment, N+N stack up configuration, laser vias, and support for blind and buried vias, this PCB exemplifies the cutting-edge technology offered by Rocket-PCB.

Electronics designers and manufacturers can leverage the capabilities of this advanced PCB to meet the demands of modern electronic devices with complex circuitry and high-frequency requirements. Rocket-PCB continues to lead the industry in providing innovative solutions, empowering businesses to create reliable and efficient electronic products for a wide range of applications.